SRG091x and SRG093x: more integration, less complexity, reduced time-to-market

With the integration of CPU, LPDDR4X memory (up to 2 GB) and eMMC (up to 256 GB) in a single compact module (46 × 41.5 × 3 mm, LGA + LCC format), designers can:
- Reduce the number of external components
- Simplify the layout of the board
- Decrease design risks
- Optimize BOM and overall costs

The operating temperature of -40 °C / +85 °C ensures reliability even in critical operating environments.

Support for Linux, FreeRTOS, and Zephyr allows you to choose the development environment best suited to your application, making it easy to migrate from existing projects or build new, scalable platforms.
The availability of single-core and dual-core versions makes it possible to select the appropriate level of performance, balancing computing power and power consumption.

The large number of integrated interfaces further reduces external components and development time:
- Ethernet 1 Gbps, RGMII
- USB, SDIO 3.0
- SPI, UART, I²C
- CAN-FD
- ADC up to 16 bits
- Up to 94 GPIOs
- Interfaces for LCM, Camera and Audio

An optional dual-band Wi-Fi 6 module with Bluetooth® LE 5.4 is also available, enabling the integration of high-performance wireless connectivity without hardware redesign.

With their compact size, low-power modes and high integration, the SRG091x and SRG093x modules are an optimal solution for:
- Optical control systems and intelligent scanners
- Smart home and building automation devices
- Access control and security
- Energy management instrumentation
- EV charging stations
- Industrial systems with multiple interfaces

The availability of evaluation kits dedicated enables R&D teams to quickly begin testing and prototyping activities, reducing design risk and accelerating time-to-market.